| Abstract:Aiming at the bottleneck issues of high-performance sliders in linear motion systems for integrated circuit (IC) equipment—such as operational stalling, abnormal noise, and precision degradation—this study proposes an integrated solution combining contact mechanics optimization, synergistic process parameters, and intelligent equipment integration. First, based on non-Hertzian contact theory, a contact model for the steel ball–raceway entry edge was established to inversely solve the optimal chamfer profile for stress distribution. Orthogonal experiments determined the optimal parameter set for grinding wheel dressing and chamfer grinding, reducing the slider’s starting friction fluctuation by 60% and lowering high-speed noise below 48 dB. Second, for the finish grinding process, Response Surface Methodology (RSM) was used to build a quantitative model relating grinding depth, wheel speed, and workpiece speed to surface roughness (Ra) and material removal rate (MRR). Multi objective particle swarm optimization (MOPSO) was applied for global optimization, obtaining a Pareto optimal solution set [1]. Verification experiments confirmed that the optimized parameters stabilize Ra at 0.038–0.05 μm while maintaining machining efficiency. Finally, an intelligent grinding equipment system was developed, featuring online monitoring with automatic wheel wear compensation, same reference arc surface conveying, and flexible clamping synchronous motion mechanisms, along with a process database and CNC program library. Application on a demonstration production line at a partner enterprise raised the slider qualification rate from below 85% to nearly 100%, while improving productivity by over 40%. The key manufacturing processes and equipment system established in this work provide an effective technical route for enhancing the independent manufacturing capability and reliability of core components for IC equipment in China. |
点此下载全文
位访问者,今日访问
次